Address
#10, K.E.B Road, Newpet
Anekal, Bangalore -562106
Work Hours
Monday to Saturday: 9AM - 6PM
Understanding the Importance of Printed Circuit Boards (PCBs)
Printed circuit boards (PCBs) play a crucial role in today’s technology-driven world, serving as the backbone of nearly every electronic and electrical device. These versatile boards come in various configurations, enabling them to fulfill a wide range of functions and capabilities. As technology advances, the demand for high-quality PCBs continues to grow.
Common Causes of PCB Failures
Several factors can contribute to PCB failures, including:
- Defects During Assembly
- Burnt Components
- Environmental Influences (heat and humidity)
- Soldering Issues
- Human Error
- Old Age
Expert PCBA Analysis Services
We are one of the few laboratories in India offering comprehensive PCB Assembly (PCBA) analysis, including:
- Cross-Sectional Analysis
- Dye and Pry Test
- High-Magnification Examination
Non-destructive techniques like visual and X-ray inspections do not always guarantee the integrity of circuit boards. High-magnification cross-sectional examinations are essential for detecting cracks, conducting IPC-A-600 inspections, measuring plate thickness, and performing failure analysis.
Our Cross-Sectioning Process
Our process begins with mounting a targeted segment of the PCB in a protective potting material, ensuring support during the polishing process. The sample is meticulously polished using progressively finer media to reach the desired examination plane. The prepared specimen is then analyzed at various magnifications using optical microscopy or scanning electron microscopy (SEM).
With a robust metallurgical background and highly trained technicians, we routinely perform single sample mounts but can also regrind samples to target multiple areas or adjust orientation as needed.
Trust us for precise and thorough PCBA analysis, ensuring the reliability and performance of your printed circuit boards.
EXAMINING QUALITY OF SOLDER JOINTS IN PCB
BAD SOLDER
GOOD SOLDER
DYE AND PRY TEST
The Dye and Pry Test, previously referred to as Dye and Pull, is a specialized procedure designed to detect cracks in Ball Grid Arrays (BGAs) and is also effective for other surface-mounted components like Quad Flat No-lead (QFN) and Dual Flat No-lead (DFN) packages.
During the test, a dye penetrant is applied to identify any cracks or defects. Once detected, these cracks are meticulously mapped and categorized for each component, allowing for thorough analysis and quality assurance. This method is crucial for maintaining the integrity and reliability of electronic assemblies, ensuring optimal performance in critical applications.
