Printed Circuit Boards (PCBs) play a crucial role in modern technology, forming the backbone of almost every electronic or electrical device. As technology evolves, the demand for reliable PCBs increases, making PCB testing and analysis essential to ensure performance, longevity, and safety.
Common Causes of PCB Failures
At Sirige Quality Laboratory, we are among the few laboratories in India equipped to carry out comprehensive PCBA analysis, including
Cross-Sectional Analysis
Dye and Pry Test (IPC-A-610 Evaluation)
Cross-Sectional Analysis
Non-destructive methods like visual inspection or X-ray analysis cannot always ensure the integrity of PCBs. Cross-sectional examination at high magnification is required for:
- Crack detection
- IPC-A-600 inspections
- Plate thickness measurement
- Failure analysis
The process involves mounting a target segment of the PCB in a potting material for support and protection during polishing. The sample is carefully polished using progressively finer media until the plane of interest is reached, then examined under optical microscopy or Scanning Electron Microscopy (SEM).
Our laboratory has a strong metallurgical background with highly trained technicians capable of preparing single or multiple targets within the same mount to ensure accurate evaluation.
Dye and Pry Test (IPC-A-610 Evaluation)
The Dye and Pry Test, formerly called Dye and Pull, detects cracks in Ball Grid Arrays (BGA) and other surface-mounted components like QFNs or DFNs. Cracks are mapped and categorized for each component, enabling precise identification of failure points and quality issues.
With Sirige Quality Laboratory’s PCB Testing and PCBA Analysis, manufacturers can ensure high reliability, optimal performance, and long-term durability of their electronic products.
